HiSilicon Kirin 970 vs Qualcomm Snapdragon 8cx Gen. 2. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 970 Qualcomm Snapdragon 8cx
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  6 3
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A73 4x Kryo 495 Gold
• B-Core
  4x Cortex-A53 4x Kryo 495 Silver
• Base Frequency
  1.84 GHz 1.8 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.4 GHz 2.84 GHz
• Turbo Frequency (8 Cores)
  2.4 GHz 2.84 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12.0
• Execution units
  12 0
• Generation
  Bifrost 2 6
• GPU Frequency
  750 MHz 250 MHz
• GPU name
  ARM Mali-G72 MP12 Qualcomm Adreno 690
• GPU Turbo
  No turbo 590 MHz
• Max. displays
  1 0
• Max. GPU Memory
  2 GB -
• Release date
  Q3/2017 Q4/2020
• Shader
  192 0
• Technology
  16 nm 7 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode Conflicting source values: Decode | Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 8cx Gen. 2 and HiSilicon Kirin 970. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  8 GB -
• Memory channels
  4 8
• Memory type
  LPDDR4X-2133 LPDDR4X-2133

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 970 and Qualcomm Snapdragon 8cx Gen. 2 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  9 W 7 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 970 and Qualcomm Snapdragon 8cx Gen. 2, virtual machine technologies and process technology.

• Architecture
  Cortex-A73 / Cortex-A53 Kryo 495
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  2 MB 2 MB
• Release date
  Q3/2017 Q4/2018
• Technology
  10 nm 7 nm
• Virtualization
  None None