Qualcomm Snapdragon 425 vs MediaTek Dimensity 1100. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Mediatek Dimensity
• Generation
  3 2
• CPU group
  Qualcomm Snapdragon 425/427 MediaTek Dimensity 1100/1200

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.40 GHz 2.00 GHz
• CPU Cores
  4 8
• Turbo (1 Core)
  1.40 GHz 2.60 GHz
• CPU Threads
  4 8
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  normal hybrid (big.LITTLE)
• A core
  -- 4x Cortex-A78
• B core
  -- 4x Cortex-A55

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 308 ARM Mali-G77 MP9
• GPU frequency
  0.50 GHz 0.85 GHz
• GPU (Turbo)
  0.50 GHz No turbo
• Execution units
  0 9
• Shader
  24 144
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 1
• Generation
  3 Vallhall 1
• DirectX Version
  11 12
• Technology
  28 nm 7 nm
• Release date
  Q1/2016 Q2/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 1100 and Qualcomm Snapdragon 425. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3-667 LPDDR4X-2133
• ECC
  No No
• Memory channels
  1 4

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 425 and MediaTek Dimensity 1100 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 425 and Qualcomm Snapdragon 425, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A53 Cortex-A78 / Cortex-A55
• Technology
  28 nm 6 nm
• Socket
  N/A N/A
• Release date
  Q3/2016 Q1/2021
• Part Number
  MSM8917 MT6891Z/CZA