AMD Ryzen 3 PRO 8305GE vs AMD Ryzen 9 9900X

差异
 规格基准褒奖

差异

需要考虑的原因
AMD Ryzen 3 PRO 8305GE

报告一个错误

Lower stated TDP / base power

Power limits alone do not measure performance per watt.

35 W 120 W

所有排名中的位置

共同立场 AMD Ryzen 3 PRO 8305GE 在流行的基准测试中的CPU，用于与其他型号进行比较.

No data

需要考虑的原因
AMD Ryzen 9 9900X

报告一个错误

更高的时钟速度

左右 26% 更好的时钟速度

4.4 GHz 3.5 GHz
更多的核心数量

8 more cores

12 4
更高的涡轮增压时钟速度

左右 14 % higher specified turbo frequency

5.6 GHz 4.9 GHz

所有排名中的位置

共同立场 AMD Ryzen 9 9900X 在流行的基准测试中的CPU，用于与其他型号进行比较.

No data

规格

技术数据

AMD Ryzen 3 PRO 8305GE

AMD Ryzen 9 9900X

CPU家族和团体

有关被比较的处理器、系列、代数和细分市场的背景信息。

系列

Ryzen PRO Ryzen
Form Factor

Desktops Desktops / Boxed Processor
分段

Desktop Desktop
Series

Ryzen PRO 8000 Series Ryzen 9000 Series

CPU技术规格

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

Base Frequency

3.5 GHz 4.4 GHz
CPU核数

4 12
CPU线程

8 24
Max. Boost Clock

4.9 GHz 5.6 GHz
超频

- 是
Turbo Frequency (1 Core)

- 5.6 GHz

IGPU

内部图形不影响CPU的性能，在没有显卡或在移动设备上执行显卡的工作。

GPU Frequency

2600 MHz 2200 MHz
GPU名称

AMD Radeon 740M AMD Radeon Graphics
Graphics Cores

4 2

内存规格和PCI

支持的RAM的类型、通道数量 AMD Ryzen 9 9900X 和 AMD Ryzen 3 PRO 8305GE. 根据主板的不同，可能支持更高或更低的内存频率。

记忆通道

2 2
存储器类型

DDR5 DDR5
PCIe

PCIe 4.0 PCIe 5.0

能源消耗

比较TDP的要求 AMD Ryzen 3 PRO 8305GE 和 AMD Ryzen 9 9900X Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Default TDP

35 W 120 W
Maximum Operating Temperature

95 °C 95 °C
TDP (PL1 / PBP, legacy combined label)

- 120 W

技术和扩展

架构、接口、所支持的额外指令 AMD Ryzen 3 PRO 8305GE 和 AMD Ryzen 9 9900X, 虚拟机技术和工艺技术。

Codename

Phoenix Granite Ridge AM5
L2-Cache

4 MB 12 MB
L2-Cache

8 MB 64 MB
Official source

https://www.amd.com/en/products/processors/desktops/ryzen-pro/8000-series/amd-ryzen-3-pro-8305ge.html https://www.amd.com/en/products/processors/desktops/ryzen/9000-series/amd-ryzen-9-9900x.html
发布日期

2025-12-04 2024-08-15
插座

AM5 AM5
技术过程

TSMC 4nm FinFET TSMC 4nm FinFET
Verified on

2026-09-30 2026-09-30
建筑学

- Zen 5
I/O die process

- TSMC 6nm FinFET
Verification scope

- Explicit manufacturer fields refreshed; other original historical fields retained, not all reverified. Partial composite conflicts are preserved.

Results with primary test sources

Published measurements are separate from the archived index. Incomplete conditions and unknown run counts do not support ranking positions or calculated performance differences.

Model	Test	Result	Reported conditions	Source / retrieved
AMD Ryzen 9 9900X	Cinebench R15 / multi-core	5008 points	Graphics card: GeForce RTX 4090	Notebookcheck 2026-09-30 UTC
AMD Ryzen 9 9900X	Cinebench R15 / single-core	353 points	Graphics card: GeForce RTX 4090	Notebookcheck 2026-09-30 UTC
AMD Ryzen 9 9900X	Cinebench R20 / multi-core	12551 points	Graphics card: GeForce RTX 4090	Notebookcheck 2026-09-30 UTC
AMD Ryzen 9 9900X	Cinebench R20 / single-core	885 points	Graphics card: GeForce RTX 4090	Notebookcheck 2026-09-30 UTC
AMD Ryzen 9 9900X	Cinebench R23 / multi-core	32172 points	Graphics card: GeForce RTX 4090	Notebookcheck 2026-09-30 UTC
AMD Ryzen 9 9900X	Cinebench R23 / single-core	2253 points	Graphics card: GeForce RTX 4090	Notebookcheck 2026-09-30 UTC
AMD Ryzen 9 9900X	Cinebench 2024 / multi-core	1818 points	Graphics card: GeForce RTX 4090	Notebookcheck 2026-09-30 UTC
AMD Ryzen 9 9900X	Cinebench 2024 / single-core	138 points	Graphics card: GeForce RTX 4090	Notebookcheck 2026-09-30 UTC

基准

性能测试 CPUs

No comparable benchmark results are available yet. Specifications alone do not determine which model is faster.

These are saved results from the earlier catalog. Measurement dates and test configurations were not recorded. Models with no comparable results are omitted.

Recent models: test results with identified primary sources — Cinebench R23 · Cinebench R20 · Cinebench R15 · Cinebench 2026 · RandomX benchmark