AMD Ryzen AI 9 HX PRO 475 — Specifications

Specifications Benchmarks (tests) Synonyme

Specifications

Technische Daten

Prozessorgeneration und -serie

Serie
Ryzen PRO
Form Factor
Laptops / Desktops
Name
AMD Ryzen AI 9 HX PRO 475
Segment
Mobile
Series
Ryzen AI PRO 400 Series

CPU Kerne und Basisfrequenz

Base Frequency
2 GHz
CPU Kerne
12
CPU Threads
24
Max. Boost Clock
5.2 GHz

Interne Grafiken

GPU Frequency
3100 MHz
GPU-Name
AMD Radeon 890M
Graphics Cores
16

Speicher & PCIe

Speicherkanäle
2
Speicher Typ
DDR5 (FP8) / LPDDR5X (FP8)
PCIe
PCIe 4.0

Energieverbrauch

Configurable TDP
15-54 W
Default TDP
28 W
Maximum Operating Temperature
100 °C

Technische Einzelheiten

Codename
Gorgon Point
L2-Cache
12 MB
L3-Cache
24 MB
Official source
https://www.amd.com/en/products/processors/laptop/ryzen-pro/ai-400-series/amd-ryzen-ai-9-hx-pro-475.html
Datum der Veröffentlichung
2026-01-05
Steckdose
FP8
technisches verfahren
TSMC 4nm FinFET
Verified on
2026-09-30

Positionen in allen Ranglisten

Gemeinsame Standpunkte AMD Ryzen AI 9 HX PRO 475 CPU in gängigen Benchmarks, zum Vergleich mit anderen Modellen.

No data

Benchmarks (tests)

Leistungstests CPU

No benchmark results are available yet. This model is listed with specifications only.

These are saved results from the earlier catalog. Measurement dates and test configurations were not recorded. Models with no comparable results are omitted.

Recent models: test results with identified primary sources — Cinebench R23 · Cinebench R20 · Cinebench R15 · Cinebench 2026 · RandomX benchmark

Comparable benchmark results are required to suggest performance alternatives.

PL1 is the sustained processor power limit; PL2 is the short-term turbo power limit. They are not measured performance or efficiency.

Die Werte werden zur Auswahl des optimalen Kühlsystems und der Stromversorgung verwendet.

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AMD Ryzen AI 9 HX PRO 475